3M 9703 hi anisotropic a ni a, Z-Axis electrically conductive adhesive transfer tape hmanga siam, acrylic adhesive matrix, tangkarua conductive particle hmanga khat a ni. Outgassing characteristic hniam tak tak leh pressure-sensitive adhesive (PSA) tack property te a nei a. He tape hian vertical electrical conduction tha tak (a chung atanga a hnuai thlengin) a siam thei a, chutih rualin lateral (x–y) plane-ah insulate a ni a, hei hian a kianga circuitry short loh nan a pui bawk. Electronics-a grounding, interconnects, leh EMI (electromagnetic interference) control-na atan hman a ni nasa hle a, a bik takin outgassing hniam, high-frequency conductivity, aerospace, defense, leh precision electronics ang chi system-ah te hman a ni nasa hle.
Nihphung
- Anisotropic Z-Axis electrical conductivity (thickness kaltlanga conductive, plane across insulating)
- Low-Outgassing acrylic adhesive chu hmun ruak emaw, hmun sensitive tak tak emaw atana hman theih tur a ni.
- PSA Tack Properties hmangin final assembly hmain parts te chu a hmunah a awm thei a ni .
- Standard assembly operation-a hman theih tura inpeih - thermal curing a ngai lo.
- Halogen free leh ROHS zawm tur a ni.
- die-cut emaw, roll form-a pek emaw a ni thei a, chu chu flexible manufacturing integration atan a ni.
- Surface variation nena inmilna tha tak, uneven surface hrang hranga consistent contact theihna tur
Application chungchang sawifiahna .
3M 9703 hian z-axis conductivity chu lateral conduction tel lovin a pe a, hei hi compact electronic assembly-a grounding, ESD/emi shielding, interconnection, leh electrical pathways atan a tha hle. A outgassing property tlem avangin a bik takin sensitive electronic system te tan a tha hle a, chung zingah chuan aerospace, medical, leh high-reliability devices te pawh a tel a ni.
Application-ah chuan tape hi a tlangpuiin conductive substrate pahnih (eg flexible circuit leh metal chassis) inkarah dah a ni a, chu chuan thickness direction-a current flow a phalsak a, chutih rualin unwanted cross-surface-a talk emaw shorts emaw a awm lo. Pressure-sensitive a nih avangin parts te chu process hmain hun engemaw chen atan an vawng thei a, chu chuan manufacturing line-ah pawh a awlsam phah a ni.
A hman dan tlangpui / hman dan case .
- Printed circuit boards (PCBS) chu chassis grounding emaw EMI shielding emaw atanga siam a ni.
- Rigid board (flex- atanga{1}board) thlenga inthlak danglam theihna circuit te chu inzawm tlat a ni.
- Camera module, image sensor, module te chu grounding path compact tak tak mamawh a ni.
- Sensor assembly, MEMS hmanrua, leh microelectronic module te a awm bawk.
- Chassis, frame emaw, in sakna tur emaw electronics-a grounding .
- Outgassing environment hniam (eg aerospace, satellite system) mamawhna application te.
- High-frequency electronic subsystems-a electromagnetic interference tihziaawmna.
Hmanrua
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